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ZHX2022
FIR Transceiver
Product Specification
PS021802-1005
ZiLOG Worldwide Headquarters * 532 Race Street * San Jose, CA 95126-3432 www.ZiLOG.com
This publication is subject to replacement by a later edition. To determine whether a later edition exists, or to request copies of publications, contact: ZiLOG Worldwide Headquarters
532 Race Street San Jose, CA 95126-3432 www.ZiLOG.com
ZiLOG is a registered trademark of ZiLOG Inc. in the United States and in other countries. All other products and/or service names mentioned herein may be trademarks of the companies with which they are associated.
Document Disclaimer
(c)2005 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZiLOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. Devices sold by ZiLOG, Inc. are covered by warranty and limitation of liability provisions appearing in the ZiLOG, Inc. Terms and Conditions of Sale. ZiLOG, Inc. makes no warranty of merchantability or fitness for any purpose. Except with the express written approval of ZiLOG, use of information, devices, or technology as critical components of life support systems is not authorized. No licenses are conveyed, implicitly or otherwise, by this document under any intellectual property rights.
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Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Parts Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinout and Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical and Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended Circuit Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 I/O and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Mode Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s) . . . . . . . . 14 Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s) . . . . . . . . 15 Recommended SMD Pad Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ZHX2022 Soldering and Cleaning Recommendations . . . . . . . . . . . . . . . . . . . Reflow Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Manual Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 16
Current Derating Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Taping Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Customer Feedback Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Customer Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Product Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Return Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Problem Description or Suggestion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 22 22 22 22
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List of Figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. FIR Transceiver Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Mode Switching Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Pad Layout (mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Temperature Derating Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reel Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Tape Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Tape Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
List of Tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Eye Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical Characteristics--Transceiver . . . . . . . . . . . . . . . . . . . . . . . 6 Optoelectronic Characteristics--Receiver . . . . . . . . . . . . . . . . . . . . . 8 Optoelectronic Characteristics--Transmitter . . . . . . . . . . . . . . . . . . . 9 Recommended Application Circuit Components . . . . . . . . . . . . . . . 13 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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Description
Whether you need to mount the IrDA transceiver so that its communication is parallel or perpendicular to the plane of the PCB, the ZiLOG ZHX2022 is the solution for applications in portable products, such as USB Adapters, notebook PCs, printers, mobile phones, digital cameras, handheld devices, or personal data assistants (PDAs). Designed to support all IrDA data rates up to 4 Mbits/second as well as LocalTalkTM and Sharp ASKTM modes, the transceiver combines an infrared emitting diode (IRED) emitter, a PIN photodiode detector, an IRED driver, and an integrated AGC (Automatic Gain Control) and amplification receive circuit in a single, miniature package. The ZiLOG ZHX2022 provides an efficient implementation of the IrDA-Data 1.4 standard in a small footprint format. Application circuit space is also minimized, as only three external components (current-limiting resistor, terminating resistor, and a decoupling capacitor) are required to implement a complete IrDA transceiver solution. The ZHX2022 is capable of both mode select and legacy-mode bandwidth switching.
Features * * * * * * *
Supply voltage 2.7 V to 5.5 V, operating idle current (receive mode) < 3 mA, shutdown current < 5 A over full temperature range Surface mount package, top and side view, 9.7 mm x 4.7 mm x 4.0 mm Operating temperature: -30 C to 85 C Storage temperature: -40 C to 85 C Transmitter wavelength typically 886 nm, supporting IrDA(R) and Remote Control Tri-state-receiver output, floating in shut down with a weak pull-up Eye safety class 1 (IEC60825-1, ed. 2001), limited LED on-time, LED current is controlled, no single fault to be considered
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Applications * * * * * * * Parts Table
Part Description Quantity/ Reel 1,000 pieces 1,000 pieces
Notebook computers, desktop PCs, palmtop computers (Win CE, Palm PC), PDAs Digital still and video cameras Printers, fax machines, photocopiers, screen projectors Telecommunication products (cellular phones, pagers) Internet TV boxes, video conferencing systems External infrared adapters (dongles) Medical and industrial data collection
ZHX2022MV040THTR Oriented in carrier tape for side-view surface mounting ZHX2022TV040THTR Oriented in carrier tape for top-view surface mounting
Note: All ZiLOG devices are available lead free. ZHX2022 has always been lead free. These devices meet or exceed RoHS Directive 2002/95/EC. For additional information, please see the ZiLOG Quality and Reliability web page at http://www.zilog.com/quality/index.asp.
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Block Diagram
Figure 1 is the block diagram for the FIR transceiver.
Tri-State Driver Amplifier Comparator Rxd
VCC2 Controlled Driver Mode SD Txd Logic & Control
VCC1
GND
Figure 1. FIR Transceiver Block Diagram
Pinout and Pin Description
Figure 2. Pinout
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Table 1. Pin Description Pin Number Function 1 VCC2 LEDA Description Connect LEDA directly to either VCC1 (regulated) or to VCC2 (unregulated) or battery. For voltages higher than 3.6 V, an external resistor might be necessary for reducing the internal power dissipation. IRED cathode, internally connected to driver transistor. Do not connect. This input is used to transmit serial data when SD is low. An on-chip protection circuit disables the LED driver if the Txd pin is asserted for longer than 80 s. When used in conjunction with the SD pin, this pin is also used to receiver speed mode. Received Data Output, push-pull CMOS driver output capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 k (typical) in shutdown mode. Shutdown, also used for dynamic mode switching. Setting this pin active places the module into shutdown mode. On the falling edge of this signal, the state of the Txd pin is sampled and used to set receiver low bandwidth (Txd=Low, SIR) or high bandwidth (Txd=High, MIR and FIR) mode. Will be overwritten by the mode pin input, which must float, when dynamic programming is used. Supply voltage (regulated) HIGH: High speed mode, MIR and FIR; LOW: Low speed mode, SIR only (see "Mode Switching" on page 13). The mode pin can also be used to indicate the dynamically programmed mode. The maximum load is limited to 50 pF. High indicates FIR/MIR mode, low indicates SIR mode Ground I I HIGH I/O Active
2 3
LEC Txd
4
Rxd
O
LOW
5
SD
I
HIGH
6 7
VCC1 Mode
7
Mode
O
8
GND
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Electrical and Timing Specifications
Notes: Reference point: Ground Pin 8, unless otherwise noted Typical values are for design aid only, not guaranteed nor subject to production testing.
Table 2. Absolute Maximum Ratings Parameter Test Conditions Symbol VCC1 VCC2 Min Typical -0.5 -0.5 Max +6 +6.5 10 25 See derating curve (Figure 6). PD TJ Tamb Tstg See "ZHX2022 Soldering and Cleaning Recommendations" on page 16. IRED(DC) < 90 s, ton < 20% Vin > VCC1 is allowed IRED(RP) VIREDA VIN -0.5 -30 -40 500 125 +85 +85 240 Unit V V mA mA mW
Supply voltage range, transceiver 0 V < VCC2 < 6 V Supply voltage range, transmitter 0 V < VCC1 < 6 V Input currents Output sinking current Power dissipation Junction temperature Ambient temperature range (operating) Storage temperature range Soldering temperature For all pins, except IRED anode pin
C C C C
Average output current Repetitive pulse output current IRED anode voltage Voltage at all inputs and outputs Load at mode pin when used as mode indicator
125 600 +6.5 5.5 50
mA mA V V pF
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Notes: Reference point pin: GND, unless otherwise noted Typical values are for design aid only, not guaranteed nor subject to production testing.
Table 3. Eye Safety Information Parameter Virtual source size Test Conditions Method: (1 - 1/e) encircled energy Symbol d Ie Min 2.5 Typical 2.8 * 500** Max Unit mm mW/sr
Maximum Intensity for Class 1 IEC60825-1 or EN60825-1, edition January 2001
* Due to the internal limitation measures, the device is a "class1" device. ** IrDA specifies the maximum intensity with 500 mW/sr.
Notes: Tamb=25 C, VCC=2.7 V to 5.5 V, unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing.
Table 4. Electrical Characteristics--Transceiver Parameter Supply voltage Dynamic supply current (Idle)1 Dynamic supply current (Idle)1 SD=Low, Ee=0 klx SD=Low, E =1 klx2 Test Conditions Symbol VCC ICC ICC Min 2.7 2 2 Typical Max 5.5 3 3 Unit V mA mA
1) Receive mode only. In transmit mode, add additional 85 mA (typical) for IRED current. Add Rxd output current depending on Rxd load. 2) Standard Illuminant A 3) The typical threshold level is between 0.5 x VCC2 (VCC=3 V) and 0.4 x VCC (VCC=5.5 V). It is recommended to use the specified min/max values to avoid increased operating current. ESD > 4000 V (HBM), Latchup > 200 mA EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz, no external shield)
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Table 4. Electrical Characteristics--Transceiver (Continued) Parameter Shutdown supply current Test Conditions SD=High, Mode=Floating Ee=0 klx SD=High, Mode=Floating Ee=1 klx2 Symbol ISD ISD Min Typical Max 2.0 2.5 5 Unit
A A A
SD=High, T=85 C, ISD Mode=Floating, not ambient light sensitive Operating temperature range Output voltage low Output voltage high IOL=1 mA, Cload=15 pF IOH=250 A, Cload=15 pF Output Rxd current limitation Short to Ground high state Output Rxd current limitation Short to VCC1 low state Rxd to VCC1 impedance Input voltage low (Txd, SD, Mode) Input voltage high (Txd, SD, Mode) CMOS level3 TTL level, VCC1=4.5 V Input leakage current (Txd, SD) Input leakage current Mode Input capacitance (Txd, SD, Mode) SD=High RRxd VIL VIH VIH IL IICH CI 400 0.5 VCC - 0.5 2.4 -10 -2 500 TA VOL 0.8 x VCC 0.9 x VCC VOH -25
+85 0.4
C
V V V
IOH=500 A, Cload=15 pF VOH
20 20 600 0.5
m m
k
V
VCC+0.5 V V +10 +2 5
A A
pF
1) Receive mode only. In transmit mode, add additional 85 mA (typical) for IRED current. Add Rxd output current depending on Rxd load. 2) Standard Illuminant A 3) The typical threshold level is between 0.5 x VCC2 (VCC=3 V) and 0.4 x VCC (VCC=5.5 V). It is recommended to use the specified min/max values to avoid increased operating current. ESD > 4000 V (HBM), Latchup > 200 mA EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz, no external shield)
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Notes: Tamb=25 C, VCC=2.7 V to 5.5 V, unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing.
Table 5. Optoelectronic Characteristics--Receiver Parameter Test Conditions Symbol Ee Ee Ee Ee Ee tr (Rxd) tf (Rxd) tPW tPW 4 (0.4) 10 10 1.5 110 1.8 250 40 40 Min Typical Max Unit 25 (2.5) 65 (6.5) 80 (8.0) 5 (500) 35 mW/m2 (3.5) (W/cm2) mW/m2 (W/cm2) 90 mW/m2 (9.0) (W/cm2) kW/m2 (mW/cm2) mW/m2 (W/cm2) ns ns
Minimum detection threshold 9.6 kbit/s to 115.2 kbit/s irradiance, SIR mode =850 nm to 900 nm Minimum detection threshold 1.152 Mbit/s irradiance, MIR mode =850 nm to 900 nm Minimum detection threshold 4.0 Mbit/s irradiance, FIR mode =850 nm to 900 nm Maximum detection threshold irradiance No detection receiver input irradiance Rise time of output signal Fall time of output signal Rxd pulse width of output signal, 50% SIR mode Rxd pulse width of output signal, 50% MIR mode Rxd pulse width of output signal, 50% FIR mode
=850 nm to 900 nm
* 10% to 90%, 15 pF 90% to 10%, 15 pF input pulse length 1.4 s < PWopt < 25 s input pulse length PWopt=217 ns, 1.152 kbit/s input pulse length PWopt=125 ns, 4.0 Mbit/s input pulse length PWopt=250 ns, 4.0 Mbit/s
2.1 s 270 ns
tPW
100
140 ns
tPW
225
275 ns
Stochastic jitter, leading edge input irradiance=100 mW/m2, 4.0 Mbit/s
20
ns
Note: All timing data measured with 4 Mbit/s are measured using the IrDA(R) FIR transmission header. The data given here are valid 5 s after starting the preamble. *This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps.
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Table 5. Optoelectronic Characteristics--Receiver (Continued) Parameter Test Conditions input irradiance=100 mW/m2, 1.152 Mbit/s input irradiance=100 mW/m2, 576 kbit/s input irradiance=100 mW/m2, < 115.2 kbit/s Receiver start up time After completion of shutdown programming sequence Power on delay tL 170 Symbol Min Typical Max Unit 40 80 ns ns
350 ns 500 s
Latency
300 s
Note: All timing data measured with 4 Mbit/s are measured using the IrDA(R) FIR transmission header. The data given here are valid 5 s after starting the preamble. *This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps.
Notes: Tamb=25 C, VCC=2.7 V to 5.5 V, unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing.
Table 6. Optoelectronic Characteristics--Transmitter Parameter IRED operating current, switched current limiter Test Conditions Symbol ID Min 500 Typical Max Unit 550 600 mA
See derating curve (Figure 6). For 3.3 V operations, no external resistor needed. For 5 V application, that might be necessary depending on operating temperature range.
Output leakage IRED current
IIRED
-1
1
A
*Typically, the output pulse duration will follow the input pulse duration t and will be identical in length t. However, at pulse duration larger than 80 s, the optical output pulse duration is limited to 85 s. This pulse duration limitation can already start at 20 s.
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Table 6. Optoelectronic Characteristics--Transmitter (Continued) Parameter Output radiant intensity recommended application circuit Test Conditions Symbol Ie Min 120 Typical Max Unit 170 350 mW/m2 (W/cm2)
=0 , 15
Txd=High, SD=Low, VCC1=VCC2=3.3 V Internally current-controlled, no external resistor VCC1=5.0 V, a=0 , 15 Txd=Low or SD=High, (Receiver is inactive as long as SD=High)
Output radiant intensity
Ie
0.04 kW/m2 (mW/cm2)
Output radiant intensity, angle of half intensity Peak - emission wavelength Spectral bandwidth Optical rise time, fall time Optical output pulse duration input pulse width 217 ns, 1.152 kbit/s input pulse width 125 ns, 4.0 Mbit/s input pulse width 250 ns, 4.0 Mbit/s input pulse width 0.1 s < tTxd < 80 s *
P
tropt, tfopt topt topt topt topt 20 10 207 117 242 880
+24
mW/m2 (W/cm2) 900 ns
40 40 217 125 250 tTxd 85 25
ns
s
227 ns 133 ns 258 ns ns ns ns
input pulse width tTxd > 80 s topt * Optical overshoot
*Typically, the output pulse duration will follow the input pulse duration t and will be identical in length t. However, at pulse duration larger than 80 s, the optical output pulse duration is limited to 85 s. This pulse duration limitation can already start at 20 s.
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Recommended Circuit Diagram
ZiLOG transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive, and inductive wiring should be avoided. The inputs (Txd, SD, Mode) and the output Rxd should be directly (DC) coupled to the I/O circuit. See Figure 3 and Table 7. The resistor R1 is only necessary for higher operating voltages and elevated temperatures (see derating curve in Figure 6) to avoid too high internal power dissipation. The capacitor C1 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2 and C1 are optional and dependent on the quality of the supply voltage VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C1 as near as possible to the transceiver power supply pins. In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. For example, see The Art of Electronics, Paul Horowitz, Wienfield Hill, 1989, Cambridge University Press, ISBN: 0521370957.
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(Note that LEDA may be powered from a separate unregulated voltage supply.)
1.0 F ceramic Place within 3 mm of pin.
Vcc= 2.7 to 3.3 V
L R2 1 LEDA 6 Vcc
C1
IrDA enabled I/O Controller, Microcontroller, ENDEC, or ASIC Vss
IRTxD IRSD IRRxD
3 5 4
TxD SD ZHX2022 RxD MODE GND 8 7
1.0 F ceramic Place within 3 mm of pin.
Vcc= 3.4 to 5.5 V
L R1 3 5 4 R2 1 LEDA TxD SD ZHX2022 RxD MODE GND 8 7
C1
6 Vcc
IrDA enabled I/O Controller, Microcontroller, ENDEC, or ASIC Vss
IRTxD IRSD IRRxD
Note: Lands to Pins 1, 6, 3, 4, 5, and 7 should be 0.38 mm min. wide. Connect ground plane within 1.58 mm of pins.
.254 mm 4 oz. copper; 0.0356 mm thicknes
Value for R 1- For Vcc 3.3 V, use 2 ohm.
S R2 .38 mm (.015") 68
Values for R 2
.76 mm (.030") 91
S
FR4 Ground Plane
Length, L, is not important. Maintain land width constant without intermediate vias. Make corners rounded not sharp.
.762 mm (min)
Figure 3. Application Block Diagram
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Table 7. Recommended Application Circuit Components Component C1 R1 Recommended Value 1.0 F, Ceramic 5 V supply voltage: 2 , 0.25 W (recommended using two 1 , 0.125 W resistor in series) 3.3 V supply voltage: no resistors necessary; the internal controller is able to control the current 68 or 91 , 0.125 W
R2
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases, refer to the I/O manual, the ZiLOG application notes, or contact directly ZiLOG Sales, Marketing or Application.
Mode Switching
The ZHX2022 is in the SIR mode after power on as a default mode; therefore, the FIR data transfer rate has to be set by a programming sequence using the Txd and SD inputs as described in the following sections or selected by setting the Mode Pin. The Mode Pin can be used to statically set the mode (Mode Pin: LOW: SIR, HIGH: 0.576 Mbit/s to 4.0 Mbit/s). If not used or in standby mode, the mode input should float or should not be loaded with more than 50 pF. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. See Figure 4 and Table 8.
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Figure 4. Mode Switching Timing Diagram
Table 8. Truth Table Inputs SD high low low low low low Txd x high high > 80 s low low low Optical Input Irradiance mW/m2 x x x <4 > Min. Detection Threshold Irradiance < Max. Detection Threshold Irradiance > Max. Detection Threshold Irradiance Rxd weakly pulled (500 k to VCC1) high high high low (active) x Outputs Transmitter 0 Ie 0 0 0 0
To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described in the following sections are required.
Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s)
1. Set SD input to logic "HIGH". 2. Set Txd input to logic "HIGH". Wait ts > 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of Txd, which determines the speed setting).
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4. After waiting th > 200 ns, Txd can be set to logic "LOW". The hold time of Txd is limited by the maximum allowed pulse length. After that, Txd is enabled as normal Txd input, and the transceiver is set for the high bandwidth (576 kbit/s to 4 Mbit/s) mode.
Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic "HIGH". 2. Set Txd input to logic "LOW". Wait ts > 200 ns. 3. Set SD to logic "LOW" (this negative edge latches state of Txd, which determines speed setting). 4. Txd must be held for th > 200 ns. After that Txd is enabled as normal Txd input and the transceiver is set for the lower bandwidth (9.6 kbit/s to 115.2 kbit/s) mode.
Recommended SMD Pad Layout
The leads of the device should be soldered in the center position of the pads. For more configurations, see inside the device drawing.
Figure 5. Pad Layout (mm)
Note: Leads of the device should be at least 0.3 mm within the ends of the pads.
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ZHX2022 Soldering and Cleaning Recommendations
Follow these recommendations to maintain the performance of the ZHX2022 transceivers.
Reflow Soldering
Note: Please refer to ZiLOG's Lead-Free Solder Reflow: Packaging Application Note (AN0161, http://www.zilog.com/docstools.asp) for more information about the solder profile.
Manual Soldering
* * * *
Use 63/37 or silver solder. Temperature at solder iron tip: no more than 280 C Finish soldering within 3 seconds. Handle only after the ZHX2022 transceivers have cooled off.
Cleaning
Perform cleaning under the following conditions:
* * *
Cleaning agent: alcohol Temperature and time 30 seconds below 50 C or 3 minutes below 30 C Ultrasonic cleaning: below 20 W
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Current Derating Diagram
Figure 6 shows the maximum operating temperature when the device is operated without external current limiting resistor. A power dissipating resistor of 2 is recommended from the cathode of the IRED to Ground for supply voltages above 4 V. In that case the device can be operated up to 85 C, too.
Figure 6. Temperature Derating Diagram
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Mechanical Specifications
2022
Figure 7. Package Dimensions in mm
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Taping Specifications
Figure 8. Reel Dimensions in mm
Version mm C
Tape Width mm 24
A max. mm 330
N mm 60
W1 min. mm 24.4
W2 max. mm 30.4
W3 min. mm 23.9
W3 max. mm 27.4
PS021802-1005
ZHX2022 FIR Transceiver
20
18269
Figure 9. Tape Dimensions in mm
PS021802-1005
ZHX2022 FIR Transceiver
21
2022
18283
Figure 10. Tape Dimensions in mm
PS021802-1005
ZHX2022 FIR Transceiver
22
Customer Feedback Form
If you experience any problems while operating this product, or if you note any inaccuracies while reading this product specification, please copy and complete this form, then mail it to ZiLOG (see Return Information, below). We also welcome your suggestions!
Customer Information
Name Company Address City/State/Zip Country Phone Fax email
Product Information
Serial # or Board Fab #/Rev # Software Version Document Number Host Computer Description/Type
Return Information
ZiLOG System Test/Customer Support 532 Race Street San Jose, CA 95126-3432 Web site: www.zilog.com
Problem Description or Suggestion
Provide a complete description of the problem or your suggestion. If you are reporting a specific problem, include all steps leading up to the occurrence of the problem. Attach additional pages as necessary. _______________________________________________________________________________ _______________________________________________________________________________ _______________________________________________________________________________
PS021802-1005

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